creat by art - very low profile - typical height of 0.68mm - low power loss, high efficiency - ideal for automated placement - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test symbol unit v rrm v i f(av) a c j pf t j c t stg c document number: ds_d1410055 version: i14 note 2: measured at 1 mhz and applied reverse voltage of 4.0 v d.c. 0.60 0.55 150 15 35 typical junction capacitance (note 2) c/w operating junction temperature range -55 to +150 storage temperature range -55 to +150 note 1: pulse test with pw=300 s, 1% duty cycle typical thermal resistance r jl r jc r ja 15 20 105 a ma maximum reverse current @ rated vr @ t j =25 @ t j =125 i r maximum instantaneous forward voltage (note 1) @ 2.0a / t j =25c @ 2.0a / t j =125c v f v maximum average forward rectified current 2 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 25 a marking code d e f maximum repetitive peak reverse voltage 20 30 40 weight: 0.006 g (approximately) maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter SS22M ss23m ss24m mechanical data case: micro sma micro sma polarity: indicated by cathode band SS22M thru ss24m taiwan semiconductor surface mount schottk y barrier features - moisture sensitivity level: level 1, per j-std-020 - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec
creat by art part no. note 1: "x" defines voltage from 20v (SS22M) to 40v (ss24m) note 2: whole series with green compound part no. ss24m (ta=25 unless otherwise noted) document number: ds_d1410055 version: i14 SS22M thru ss24m taiwan semiconductor packing ordering information example 3,000 / 7" plastic reel rs g green compound description packing code packing code suffix package ss2xm (note 1, 2) rs g micro sma preferred part no. packing code packing code suffix ss24m rsg ratings and characteristics curves 0 0.4 0.8 1.2 1.6 2 2.4 80 90 100 110 120 130 140 150 average forward current (a) lead temperature ( o c) fig.1 maximum forward current derating curve 0 10 20 30 40 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 2 maximum forward surge current 8.3ms single half sin wave jedec method 0.0001 0.001 0.01 0.1 1 10 100 10 20 30 40 50 60 70 80 90 100 instantaneous reverse current (ma) percent of rated peak reverse voltage (%) fig. 4 typical reverse characteristics tj=25 tj=125 tj=150 SS22M ss23m-ss24m 0.1 1 10 0 0.2 0.4 0.6 0.8 1 1.2 insantaneous forward current (a) forward voltage (v) fig. 3 typical forward characteristics tj=150 tj=125 tj=25
creat by art min max min max a 2.30 2.70 0.091 0.106 b 2.10 2.30 0.083 0.091 c 0.63 0.73 0.025 0.029 d 0.10 0.20 0.004 0.008 e 1.15 1.35 0.045 0.053 f 0.65 0.85 0.026 0.034 g 1.15 1.35 0.045 0.053 h 0.75 0.95 0.030 0.037 i 1.10 1.50 0.043 0.059 j 0.55 0.75 0.022 0.030 k 0.55 0.75 0.022 0.030 l 0.65 0.85 0.026 0.034 p/n = marking code yw = date code document number: ds_d1410055 version: i14 marking diagram unit (mm) a1.1 b2.0 SS22M thru ss24m taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) micro sma suggested pad layout symbol c0.5 d0.8 e1.0 unit (inch) 0.043 0.079 0.020 0.031 0.039 1 10 100 1000 0.1 1 10 100 capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance 1 10 100 1000 0.01 0.1 1 10 100 transient therma impedance( /w) t-pulse duration(s) fig. 6 typical transient thermal impedance
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1410055 version: i14 SS22M thru ss24m taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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